Device for electromagnetic shielding and dissipation of heat released by an electronic component, and corresponding electronic circuit
US8422234B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 19, 2009 |
| Grant date | Apr 16, 2013 |
| Priority date | — |
| Expiry date | Dec 4, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10545
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A device is provided for electromagnetic shielding an electronic component and for dissipating heat generated by the component. The component includes a package designed to be fastened to a first face of a printed circuit, called a rear face, by a heat sink, the heat sink passing through the rear face of the printed circuit and emerging on a second face of the printed circuit, called a front face. The device includes a metal structure mounted on the front face of the printed circuit and defining an electromagnetic shielding enclosure. The metal structure having a first heat discharge opening lying approximately opposite the heat sink. The device further includes at least one thermal connector, a first end of which is fastened to the metal structure and a second end of which is fastened to the heat sink and/or to the front face of the printed circuit near the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.