Temperature detection method of semiconductor device and power conversion apparatus
US8423317B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 18, 2005 |
| Grant date | Apr 16, 2013 |
| Priority date | — |
| Expiry date | Feb 13, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/304
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A temperature detection method for a semiconductor device and a power conversion apparatus are disclosed. A temperature detection device is used to detect the temperature for thermal protection of a power semiconductor device. The temperature detection device is placed in the proximity of a component having the power semiconductor device packaged therein, and either an emitter terminal or a collector terminal of the power semiconductor device. Since the temperature detection device is mounted on a circuit board, it does not require insulation from a cooling fin on which the power semiconductor device is mounted and lead wires can be eliminated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.