Apparatus for thermal control in the analysis of electronic devices
US8424594B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 10, 2007 |
| Grant date | Apr 23, 2013 |
| Priority date | — |
| Expiry date | Jul 15, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/311
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A heat spreader comprising a sheet of transparent diamond with an aperture therein that accommodates a solid-immersion lens (SIL). The heat spreader may be mounted within a clamp which allows the heat spreader to move freely across the Device Under Test (DUT) while maintaining a very high degree of planarity and contact between the diamond and the silicon substrate of the DUT. The DUT is secured to its electrical interface with a low profile clamp, the DUT may be held within the clamp by a mechanism that applies a pressure to the sides of the DUT package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.