Method of manufacturing optical component and optical component
US8424746B2 · kind B2 · utility
5Cited by
14References
5Claims
0Family size
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Key dates
| Filing date | Nov 16, 2009 |
| Grant date | Apr 23, 2013 |
| Priority date | — |
| Expiry date | Mar 18, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24942
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
To easily bond substrates even made of materials whose linear expansion coefficients are different from each other when manufacturing an optical component used by transmitting light through an inside thereof.Buffer layers made of an amorphous inorganic substance causing a brittle fracture are formed on bonding surfaces of a plurality of substrates having linear expansion coefficients different from one another, and the substrates to be bonded are stacked so that the buffer layers are faced to each other. Then, a heat treatment is performed for a stack, and thereby direct bonding via an atom is formed between the buffer layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.