Patent · US Active

Sealed flexible link between a metal substrate and a ceramic substrate, method for making such a link, application of the method to sealing high temperature electrolyzers and fuel cells

US8424878B2 · kind B2 · utility

0Cited by
5References
9Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 22, 2008
Grant dateApr 23, 2013
Priority date
Expiry dateJan 10, 2030

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02P70/50
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

A device including a metal substrate and a ceramic substrate including a back-tapered groove separated from each other by a sealed flexible link. The link includes: a metal element including an end connected to the metal substrate and at another end housed in the groove of the ceramic substrate, the metal element being elastically deformable both in the groove along a direction radial to the groove and, in the separation space between the metal substrate and the ceramic substrate along the separation direction, and a joint-forming mass with a greater thermal expansion coefficient than that of the ceramic substrate and adhesively bonded to the end of the metal element housed in the back-tapered groove, the joint fitting with direct contact a portion of the height of convergent sidewalls of the groove.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.