Multi-layered thermal sensor for integrated circuits and other layered structures
US8425115B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2011 |
| Grant date | Apr 23, 2013 |
| Priority date | — |
| Expiry date | Mar 31, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K1/14
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A compact resistive thermal sensor is provided for an integrated circuit (IC), wherein different sensor components are placed on different layers of the IC. This allows the lateral area needed for the sensor resistance wire on any particular IC layer to be selectively reduced. In a useful embodiment, first linear conductive members are positioned in a first IC layer, in parallel relationship with one another. Second linear conductive members are positioned in a second IC layer in parallel relationship with one another. Conductive elements connect the first linear members into a first conductive path, and the second linear members into a second conductive path. A third conductive element extending between the first and second layers connects the first and second conductive paths into a single conductive path, wherein the path resistance varies with temperature. The path resistance is used to determine temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.