Bonded adhesion of wire-shaped individual elements by means of a two-layer acrylate resin-based system

US8425170B2 · kind B2 · utility

Assignee

• Henkel AG & Co. KGaA · DE

Inventors

• Andreas Kunz · Remscheid, DE
• Juergen Stodt · Neuss, DE
• Holger Endres · Neuss, DE
• Wolfgang Schneider · Marl, DE
• Stefan Bonekamp · Goldkronach, DE
• Patrick Podwoiski · Erkrath, DE

Key dates

• Filing date: Apr 15, 2011
• Grant date: Apr 23, 2013
• Expiry date: May 31, 2031

Classification

• Technology area (CPC F): Mechanical Engineering; Lighting; Heating
• CPC primary: F16B15/08
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

The present invention relates to a method for the bonded adhesion, or connection, of a plurality of wire-shaped individual elements into an arrangement, particularly into a wire band, wherein the adjacent individual elements have predetermined breaking points allowing for the mechanical removal of the individual elements. The bonded adhesion is brought about according to the invention utilizing a two-layer system on the basis of acrylate resins consisting of an inner coating (A) and of an outer coating (B), wherein the inner coating (A) has a lower hardness, than the outer coating. In a further aspect the invention also comprises arranging a plurality of wire-shaped individual elements through such a bonded connection, particularly a wire band.