Mold assembly having ejection mechanism
US8425221B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 3, 2010 |
| Grant date | Apr 23, 2013 |
| Priority date | — |
| Expiry date | Jan 11, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C45/4005
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A mold assembly having an ejection mechanism is disclosed and has a female mold, a male mold, a lower fixing plate, an upper ejection plate, at least one upper ejection pin, a lower ejection plate, at least one lower ejection pin and at least one process control mechanism. The female and male molds are closed to commonly define a mold cavity. The lower fixing plate and the male mold commonly define a receiving space therebetween to receive the upper ejection plate and the lower ejection plate which can be shifted upward and downward therein. The upper and lower ejection pins are mounted on the upper and lower ejection plates, respectively. The process control mechanism controls the upper and lower ejection pins to eject a molded product in two steps, so that the molded product can be automatically ejected for enhancing the manufacture efficiency of the mold assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.