Laminated interconnects for organic opto-electronic device modules and method

US8425272B2 · kind B2 · utility

Assignee

• Cambridge Display Technology Limited · GB

Inventors

• Jonathan Halls · Cambridge, GB
• Richard Wilson · Andover, US

Key dates

• Filing date: Jul 25, 2005
• Grant date: Apr 23, 2013
• Expiry date: Apr 27, 2027

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/239

Abstract

A method of producing an encapsulated module of interconnected opto-electronic devices which comprises: forming a patterned anode layer; forming a layer of opto-electronically active material over the patterned anode layer; forming a patterned cathode layer over the layer of opto-electronically active material, to provide a device array of opto-electronically active cells on the substrate; selectively removing portions of the layer of opto-electronically active material so as to expose minor portions of the anodes; forming a patterned interconnect layer on an encapsulating sheet in a pattern to define an array of interconnect pads; and laminating the patterned encapsulating sheet over the array of opto-electronically active cells whereby the exposed anode portions are interconnected with the cathodes of adjacent cells by the interconnect pads and the interconnected cells are encapsulated by the encapsulating sheet.