Patent · US Active

Use of thermoplastic molding materials for GID/WIT

US8425829B2 · kind B2 · utility

0Cited by

16References

22Claims

0Family size

Assignee

BASF SE

Inventors

Andreas Eipper · Ludwigshafen, DE
Rainer Klenz · Herbrechtingen, DE
Thomas Fritzsche · Schwetzingen, DE
Mark Völkel · Ladenburg, DE

Key dates

Filing date	May 23, 2012
Grant date	Apr 23, 2013
Priority date	—
Expiry date	May 23, 2032

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08L69/00
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

Use of thermoplastic molding compositions comprising

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.