Positive-type photosensitive composition
US8426107B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | May 13, 2009 |
| Grant date | Apr 23, 2013 |
| Priority date | — |
| Expiry date | May 13, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24479
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Disclosed is a positive-type photosensitive composition which can form a metal compound film pattern at high resolution and with less affection by organic residues. The positive-type photosensitive composition comprises: a metal complex component (A) which can form a metal compound film when applied and subsequently fired; and a photosensitizing agent (B). In the composition, a ligand in the component (A) is preferably a multidentate ligand having an aromatic compound as its skeleton. According to this construction, even a composition containing substantially no photosensitive resin can impart photosensitivity and a metal compound film pattern can be formed readily.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.