Method for producing metal substrates for HTS coating arrangements

US8426344B2 · kind B2 · utility

Assignee

• BASF SE

Inventors

• Michael Baecker · Cologne, DE
• Matina FALTER · Rheinbach, DE
• Jan Kunert · Rheinbach, DE

Key dates

• Filing date: Nov 24, 2009
• Grant date: Apr 23, 2013
• Expiry date: Nov 24, 2029

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/24355

Abstract

A method is proposed for producing a biaxially textured metal substrate having a metal surface, wherein the substrate is modified in order to produce a high-temperature superconductor coating arrangement and wherein the metal surface is modified in order to deposit a buffer layer or another intermediate layer epitaxially thereon and/or to deposit an oriented high-temperature superconductor (HTS) layer thereon. The method includes producing a biaxially textured metal substrate, subjecting the metal substrate surface to a polishing treatment, in particular an electropolishing treatment, and subjecting the metal substrate to a post-annealing after the surface polishing treatment and before a subsequent coating is performed involving epitaxial deposition of a layer of the HTS coating arrangement. This method results in smooth metal substrates with high textural overcoats and thereby improved HTS layers.