Bolometer pixel provided with a MIM integration capacitor
US8426815B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 9, 2010 |
| Grant date | Apr 23, 2013 |
| Priority date | — |
| Expiry date | Aug 9, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thermal imaging microelectronic device including: a support, a plurality of metal levels for interconnecting electronic components formed on the support, an array of thermal detectors formed on the support, each detector including a membrane with which radiant energy may be absorbed and one or more electric signals may be provided depending on the absorbed radiant energy, and a readout circuit that reads out the electric signals from the membrane, the readout circuit being integrated to the support, and at least several of the detectors having a readout circuit provided with an integrator including at least one integration capacitor disposed facing the membrane, the capacitor having at least one upper plate made in a given interconnection metal level of the plurality of interconnection metal levels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.