Micro bump and method for forming the same
US8426964B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2011 |
| Grant date | Apr 23, 2013 |
| Priority date | — |
| Expiry date | Jul 10, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/773
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for forming a micro bump includes forming a first nano-particle layer on a substrate and forming a second nano-particle layer on the first nano-particle layer. The first and second nano-particle layers include a plurality of first nano particles and a plurality of second nano particles, respectively. The method further includes irradiating a laser beam onto the second nano-particle layer, where the laser beam penetrates through the second nano-particle layer and is at least partially absorbed by at least some of the first nano particles to generate heat. The first nano particles and the second nano particles have different absorption rates with respect to the laser beam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.