Patent · US Active

Spin coating modeling

US8428762B2 · kind B2 · utility

9Cited by

0References

10Claims

0Family size

Assignee

KLA-TENCOR CORPORATION · US

Inventors

John S. Graves · Austin, US
Mark D. Smith · Austin, US
Stewart Robertson · Milpitas, US

Key dates

Filing date	Aug 12, 2010
Grant date	Apr 23, 2013
Priority date	—
Expiry date	May 5, 2031

Classification

Technology area (CPC G)Physics
CPC primaryG06F2111/10
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

A method for setting processing parameters for fabricating an integrated circuit, by creating a mathematical model of a spin coated surface of a material over a non-flat substrate surface, where the mathematical model includes, a smoothing algorithm, where the smoothing algorithm uses as inputs only, a nominal thickness of the spin coated surface, a minimum thickness of the spin coated surface, and an interaction length, and a constraint that the spin coated surface cannot intersect the substrate surface, solving the mathematical model to determine the spin coated surface, and using the modeled spin coated surface to set the processing parameters for fabricating the integrated circuit.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.