Heat dissipation device
US8430152B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 15, 2010 |
| Grant date | Apr 30, 2013 |
| Priority date | — |
| Expiry date | Sep 28, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An exemplary heat dissipation device includes a round heat sink and a fixing frame. The heat sink defines receiving depressions at an outer peripheral surface thereof. The fixing frame includes a peripheral side plate disposed around the heat sink and fixing legs corresponding to the receiving depressions of the heat sink extending downwardly from the side plate. The fixing frame includes blocks extending inwardly from an inner surface of the side plate and protruding members extending inwardly from the fixing legs. The heat sink is rotatably received in the fixing frame with a top of the heat sink abutting the blocks. When the heat sink is in an unlocked state, the protruding members align with the receiving depressions, respectively. When the heat sink is rotated to a locked state, the protruding members abut a bottom of the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.