Patent · US Active

Vapor deposition apparatus and process for continuous deposition of a thin film layer on a substrate

US8430966B2 · kind B2 · utility

1Cited by
10References
10Claims
0Family size

Assignee

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Key dates

Filing dateDec 16, 2009
Grant dateApr 30, 2013
Priority date
Expiry dateMar 13, 2031

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02P70/50
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

An apparatus and related process are provided for vapor deposition of a sublimated source material as a thin film on a photovoltaic (PV) module substrate. A receptacle is disposed within a vacuum head chamber and is configured for receipt of a source material. A heated distribution manifold is disposed below the receptacle and includes a plurality of passages defined therethrough. The receptacle is indirectly heated by the distribution manifold to a degree sufficient to sublimate source material within the receptacle. A distribution plate is disposed below the distribution manifold and at a defined distance above a horizontal plane of a substrate conveyed through the apparatus. The distribution plate includes a pattern of holes therethrough that further distribute the sublimated source material passing through the distribution manifold onto the upper surface of the underlying substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.