Copper alloy containing cobalt, nickel and silicon
US8430979B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 26, 2006 |
| Grant date | Apr 30, 2013 |
| Priority date | — |
| Expiry date | Oct 23, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A copper alloy having an improved combination of yield strength and electrical conductivity contains, by weight, from 1% to 2.5% of nickel, from 0.5% to 2.0% of cobalt, with a total nickel plus cobalt content of from 1.7% to 4.3%, from 0.5% to 1.5% of silicon with a ratio of (Ni+Co)/Si of between 3.5 and 6, and the balance copper and inevitable impurities wherein the wrought copper alloy has an electrical conductivity in excess of 40% IACS. A further increase in the combination of yield strength and electrical conductivity as well as enhanced resistance to stress relaxation is obtained by a further inclusion of up to 1% of silver.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.