Microporous layer assembly and method of making the same
US8430985B2 · kind B2 · utility
1Cited by
3References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 11, 2008 |
| Grant date | Apr 30, 2013 |
| Priority date | — |
| Expiry date | Nov 9, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24998
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
One embodiment includes a process including coating a first microporous layer onto a first decal and curing the first microporous layer and the first decal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.