Coating formulation with enhanced metal adhesion
US8431229B2 · kind B2 · utility
2Cited by
1References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2008 |
| Grant date | Apr 30, 2013 |
| Priority date | — |
| Expiry date | Oct 26, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31699
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The invention relates to a coating formulation with improved metal adhesion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.