Polyamide resin composition
US8431636B2 · kind B2 · utility
2Cited by
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12Claims
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Assignee
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Key dates
| Filing date | Dec 28, 2011 |
| Grant date | Apr 30, 2013 |
| Priority date | — |
| Expiry date | Dec 28, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polyamide resin composition according to the present invention comprises (A) crystalline polyamide resin having a glass transition temperature (Tg) of about 50 to about 100° C.; (B) crystalline polyamide resin having a glass transition temperature (Tg) of about 110 to about 160° C.; (C) inorganic filler; (D) white pigment; and (E) light stabilizer, and can have excellent surface gloss, surface reflectance, heat resistance, mechanical strength, moldability, light stability and discoloration resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.