Capacitive power and ground plane structure utilizing fractal elements for the reduction of radiated emissions
US8431826B2 · kind B2 · utility
Inventors
Key dates
| Filing date | May 14, 2010 |
| Grant date | Apr 30, 2013 |
| Priority date | — |
| Expiry date | Mar 27, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09145
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The construction of a capacitive Power and/or Ground plane sandwich with fractal element structures to achieve the reduction or elimination of radiated emissions as “noise” from the planes. This may be achieved in several formats, including the patterning of fractal elements on the outside edge of the ground plane, the patterning of fractal elements on the outside edge of the power plane and the patterning of fractal elements within both of the planes. Fractal element structures may also be formed on the edges of circuit lines, or other conductive elements within the printed circuit board. The ability of these fractal patterns to absorb or reject frequencies on the planes due to the operation of an electronic device on the printed circuit board enhancing and aiding the capacitive effect of the plane in the reduction or elimination of radiated emissions as electronic noise. By utilizing this design maximum quieting of electronic noise may be achieved in all axis (X,Y,Z) without the use of surface bypass capacitors or conventional techniques such as edge plating or via hole edge stitching.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.