Patent · US Active

MEMS package and method for the production thereof

US8432007B2 · kind B2 · utility

15Cited by

162References

18Claims

0Family size

Assignee

EPCOS AG · DE

Inventors

Anton Leidl · Munich, DE
Hans Krueger · Munich, DE
Alois Stelzl · Munich, DE
Wolfgang Pahl · Munich, DE
Stefan Seitz · Windach, DE

Key dates

Filing date	Mar 30, 2011
Grant date	Apr 30, 2013
Priority date	—
Expiry date	Mar 30, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH04R19/005
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A micro electro-mechanical systems (MEMS) package is described herein. The package includes a carrier substrate having a top side, a MEMS chip mounted on the top side of the carrier substrate, and at least one chip component on or above the top side of the carrier substrate or embedded in the carrier substrate. The package also includes a thin metallic shielding layer covering the MEMS chip and the chip component and forming a seal with the top side of the carrier substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.