Lead frames with improved adhesion to plastic encapsulant
US8432036B2 · kind B2 · utility
18Cited by
18References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 15, 2010 |
| Grant date | Apr 30, 2013 |
| Priority date | — |
| Expiry date | Apr 23, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead frame and an electronic package having improved adhesion between the lead frame and an encapsulating plastic material is disclosed. The lead frame can be pre plated having an outer layer comprising a precious metal such as palladium or gold to which is adhered a self-assembled monolayer (SAM), such as a SAM derived from an organophosphorus acid. The organophosphorus acid preferably is a mixture in which the organo groups are fluoro substituted hydrocarbons and hydrocarbons containing ethylenically unsaturated groups.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.