Multiple-membrane flexible wall system for temperature-compensated technology filters and multiplexers
US8432238B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 12, 2010 |
| Grant date | Apr 30, 2013 |
| Priority date | — |
| Expiry date | Feb 15, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P1/30
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a flexible cap system optimized for thermally-compensated technology microwave resonators. More specifically, this invention proposes a multiple-membrane flexible wall system for thermally-compensated filters and OMUX. The use of a multi-membrane flexible wall, in particular as sealing cap for a resonant cavity of an OMUX channel, makes it possible: to reduce the thermal resistance of the flexible wall, while maintaining an equivalent level of mechanical stresses exerted on said wall for a given displacement; or to reduce the mechanical stresses exerted on the flexible wall for a given displacement, while maintaining one and the same thermal resistance for said wall; or to increase the deformation of the flexible wall by maintaining an equivalent level of mechanical stresses and by maintaining an equivalent thermal resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.