Motherboard assembly having serial advanced technology attachment dual in-line memory module
US8432708B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 9, 2011 |
| Grant date | Apr 30, 2013 |
| Priority date | — |
| Expiry date | Dec 11, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/185
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A motherboard assembly includes a motherboard having an expansion slot and a storage device interface, and a serial advanced technology attachment dual in-line memory module (SATA DIMM) with a circuit board. A control chip and a storage chip are arranged on the circuit board. Two voids are defined in a top side of the circuit board. A first extending board is formed on the top side of the circuit board between the voids. An edge connector is arranged on the first extending board and connected to a power supply. The edge connector includes power pins connected to the control chip and the storage chip. A second extending board is extended from an end edge of the circuit board and includes a connector connected to the storage device interface of the motherboard. A bottom side of the second extending board is in alignment with a bottom side of the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.