Patent · US Active

Horizontal copper patching assembly

US8433063B2 · kind B2 · utility

12Cited by

7References

19Claims

0Family size

Assignee

Ortronics, Inc. · US

Inventors

Adam Murano · Derry, US
Chester H. Rynaski · Franklin, US

Key dates

Filing date	Sep 8, 2008
Grant date	Apr 30, 2013
Priority date	—
Expiry date	Feb 29, 2032

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49826
WIPO fieldTelecommunications
WIPO sectorElectrical engineering

Abstract

Assemblies and methods are provided for facilitating copper-wire patching. More particularly, the assemblies and methods involve mounting patch ports arranged along a horizontal plane (horizontally-aligned) with respect to a tray. The tray is movably mounted with respect to a cabinet enclosure, e.g., via a pivotal or translational (sliding) relationship, thereby providing easy access to the ports. The horizontally-aligned configuration advantageously increases patching density within a cabinet structure while maintaining port accessibility.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.