Repair apparatus and repair method
US8434670B2 · kind B2 · utility
2Cited by
8References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 16, 2009 |
| Grant date | May 7, 2013 |
| Priority date | — |
| Expiry date | Jun 16, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/081
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A repair apparatus includes a heating head device configured to heat a soldering member, which is soldered to a circuit board. The heating head device includes a heating head and a contact member heated by the heating head. The contact member is formed of a material having a spring characteristic and a thermal conductivity higher than a thermal conductivity of the heating head. The contact member is configured to be brought into contact with a soldered surface of the soldering member with an elastic force so as to melt a solder joining the soldering member to the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.