Solder paste mixer
US8434929B2 · kind B2 · utility
0Cited by
7References
5Claims
0Family size
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Inventors
Key dates
| Filing date | Aug 11, 2011 |
| Grant date | May 7, 2013 |
| Priority date | — |
| Expiry date | Aug 11, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB01F31/201
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A solder paste mixer includes a housing, a vibration mechanism, a rotating mechanism, and a fixture for fixing a solder paste jar. The housing defines a receiving space, and the vibration mechanism and the rotating mechanism are retained within the receiving space. The fixture can be vibrated by the vibration mechanism and rotated by the rotating mechanism.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.