Formation of solid layers on substrates
US8435603B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 3, 2004 |
| Grant date | May 7, 2013 |
| Priority date | — |
| Expiry date | Aug 10, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31699
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Disclosed is a method of forming on the surface of a substrate a first solid layer which is suitable for activating a chemical reaction to form a second layer thereon, the method comprising the steps of: applying to the surface of the substrate a first liquid comprising a curable composition and an activator for the second layer-forming chemical reaction; and curing the curable composition, thereby forming a first solid layer adhered to the surface of the substrate, capable of activating the second layer-forming chemical reaction. A second layer can then be formed on the substrate by bringing into contact with the first solid layer a second fluid comprising components of a second layer-forming chemical reaction, activated by the activator, thereby causing a second layer to be formed on the first solid layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.