Patent · US Active

Amorphous multi-component metallic thin films for electronic devices

US8436337B2 · kind B2 · utility

11Cited by

10References

7Claims

0Family size

Assignee

State of Oregon acting by and through the State Board of Higher Ed. on Behalf of Oregon State Univ. · US

Inventors

E. William Cowell, III · Portland, US
John Wager · Corvallis, US
Brady Gibbons · Corvallis, US
Douglas A. Keszler · Corvallis, US

Key dates

Filing date	May 10, 2010
Grant date	May 7, 2013
Priority date	—
Expiry date	Feb 8, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH10N70/00
WIPO fieldMaterials, metallurgy
WIPO sectorChemistry

Abstract

An electronic structure comprising: (a) a first metal layer; (b) a second metal layer; (c) and at least one insulator layer located between the first metal layer and the second metal layer, wherein at least one of the metal layers comprises an amorphous multi-component metallic film. In certain embodiments, the construct is a metal-insulator-metal (MIM) diode.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.