Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor device
US8436354B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 14, 2011 |
| Grant date | May 7, 2013 |
| Priority date | — |
| Expiry date | Sep 25, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0531
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
It is an object of the present invention to provide a method for forming a layer having functionality including a conductive layer and a colored layer and a flexible substrate having a layer having functionality with a high yield. Further, it is an object of the present invention to provide a method for manufacturing a semiconductor device that is small-sized, thin, and lightweight. After coating a substrate having heat resistance with a silane coupling agent, a layer having functionality is formed. Then, after attaching an adhesive to the layer having functionality, the layer having functionality is peeled from the substrate. Further, after coating a substrate having heat resistance with a silane coupling agent, a layer having functionality is formed. Then, an adhesive is attached to the layer having functionality. Thereafter, the layer having functionality is peeled from the substrate, and a flexible substrate is attached to the layer having functionality.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.