Light emitting diode package

US8436387B2 · kind B2 · utility

Assignee

• ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. · TW

Inventors

• CHAO-HSIUNG CHANG · Hsinchu, TW
• Ming-Ta Tsai · Hsinchu, TW

Key dates

• Filing date: Jul 21, 2011
• Grant date: May 7, 2013
• Expiry date: Aug 3, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/48091

Abstract

An LED package includes a substrate, a blue LED chip, an encapsulant and a fluorescent layer. The blue LED chip is arranged on the substrate. The encapsulant covers the blue LED chip. The fluorescent layer is arranged on a top surface of the encapsulant. The fluorescent layer includes a first fluorescent area above the blue LED chip and a second fluorescent area encircling the first fluorescent area. The first fluorescent area includes red fluorescent substance and green fluorescent substance mixed therein. The second fluorescent area includes yellow fluorescent substance mixed therein.