Power semiconductor module
US8436459B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2009 |
| Grant date | May 7, 2013 |
| Priority date | — |
| Expiry date | Sep 22, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/202
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wiring process between the provided power semiconductor module and the external circuit is simple. In the power semiconductor module, a power semiconductor element and a cylindrical conductor are joined to one surface of a lead frame. An opening of the cylindrical conductor is exposed at a surface of transfer molding resin. Sealing with the transfer molding resin is performed such that terminal portions of the lead frame protrude from peripheral side portions of the transfer molding resin. The cylindrical conductor is conductive with a control circuit. The terminal portions of the lead frame are each conductive with a main circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.