Semiconductor module and motorized equipment using the same
US8436500B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 15, 2011 |
| Grant date | May 7, 2013 |
| Priority date | — |
| Expiry date | Jan 5, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In a power module having two systems of inverter circuits for driving an electric motor of a motorized equipment, a wiring board mounted with power transistors and shunt resistances is embedded in a plate-like mold section. A plurality of lands have radiation surfaces exposed from the mold section. The radiation surfaces of a first land row constituted by a first group of the lands are provided on the same plane and the same straight line, and the radiation surfaces of a second land row constituted by a second group of the lands are provided on the same plane and the same straight line. The radiation surfaces of the first and second land rows are in surface-to-surface contact with a heat sink through insulation radiation sheets to dissipate a heat generated by the power module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.