Optical element assembly with integrally formed microlens
US8437085B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 23, 2011 |
| Grant date | May 7, 2013 |
| Priority date | — |
| Expiry date | Dec 8, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0362
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical element assembly with integrally formed microlens is presented. A wafer is provided with a plurality of adjacent IC optical elements, each optical element having an optical transmission port in a wafer top surface. A microlens array is attached to the wafer top surface, so that each microlens in the array overlies a corresponding optical element optical transmission port. Then, a wafer of optical elements with attached microlenses is formed, where each microlens has a first lens surface adhering directly to a corresponding optical transmission port. Subsequent to forming the wafer of optical elements with attached microlenses, the wafer is diced forming a plurality of optical element assemblies. Each optical element assembly includes an optical element integrally formed with an attached microlens.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.