Optical module
US8437583B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 17, 2010 |
| Grant date | May 7, 2013 |
| Priority date | — |
| Expiry date | Apr 30, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09618
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical module having a flexible substrate having, even after actual manufacturing steps, excellent transmission characteristics of high-frequency signals and an advantage that electromagnetic field radiation is reduced even when it is connected with a package. The flexible substrate used in external connection of the package of the optical module uses a flexible substrate having a coplanar line to which a lead pin is fixedly attached, a grounded coplanar line which is in contact with the coplanar region, and a microstrip line which is in contact with the grounded coplanar line. The flexible substrate has an electrode layout in which an electromagnetic field component of a surface ground line and a signal line is more dominant than an electromagnetic field component of a back-surface ground line and the signal line in a region of the coplanar line adjacent to the grounded coplanar line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.