Method for bonding metal surfaces, method for producing an object having cavities, object having cavities, structure of a light emitting diode

US8439252B2 · kind B2 · utility

Assignee

• Excelitas Technologies GMBH & Co. KG · DE

Inventors

• Ulrich Traupe · Wiesbaden, DE
• Stefan Weise · Stuttgart, DE
• Pellegrino Ballacchino · Wiesbaden, DE
• Edgar Spandl · Brechen, DE

Key dates

• Filing date: Oct 31, 2007
• Grant date: May 14, 2013
• Expiry date: May 8, 2029

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/24612
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A method for bonding two partially form-fitting surfaces of two metal bodies which contain the same metal is carried out by generating a first layer on the surface of a first one of the two bodies, the first layer containing a mixture of the metal and the oxide of the metal; generating a second layer on the first layer, the second layer containing the metal but less oxide of the metal than does the first layer; placing the partially form-fitting surfaces of the two metal bodies adjacent to each other; heating the bodies placed adjacent to each other to a temperature which lies in a target range below the melting point of the metal and above the eutectic temperature of the eutectic of the metal and the metal oxide; and holding the temperature within the target range over a predetermined or a controllable duration of time.