Light emitting diode module and back light assembly
US8439513B2 · kind B2 · utility
1Cited by
1References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2009 |
| Grant date | May 14, 2013 |
| Priority date | — |
| Expiry date | Aug 4, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10106
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present application presents a light emitting diode module comprising a substrate including a first insulating layer, a second insulating layer, and a metal layer between the first and the second insulating layers; a groove formed at the first insulating layer for exposing the metal layer; and a light emitting element disposed at the groove, and including an LED chip and body part surrounding the LED chip, wherein the LED chip contacts the metal layer for radiating heat.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.