Forming method for polymeric laminated wafers comprising different film materials
US8440044B2 · kind B2 · utility
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187References
20Claims
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Key dates
| Filing date | Jul 27, 2011 |
| Grant date | May 14, 2013 |
| Priority date | — |
| Expiry date | Jul 27, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24628
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of making a polymeric laminated wafer comprising different film materials that are softenable and formable at different softening temperatures corresponding with the film materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.