Plain bearing
US8440322B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2008 |
| Grant date | May 14, 2013 |
| Priority date | — |
| Expiry date | Dec 31, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12715
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The copper alloy (lining) prevails in an overwhelmingly large amount in a plain-bearing layer structure. Cu of the plain bearing copper-alloy diffuses into the Sn-based overlay diffuses into the Sn-based overlay and detrimentally impairs the performance of the overlay. The present invention takes a measure against this problem. An Sn-based overlay having a thickness of 3 to 19 μm is deposited by electro-plating without an intermediate layer for diffusion prevention on a plain-bearing layer, which contains Sn and Ni in a total amount of more than 4 mass % to 20 mass % (the minimum amount of Sn is 4 mass %) and has a hardness of Hv 150 or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.