Methods for manufacturing radio frequency (RF) powder
US8440487B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 24, 2012 |
| Grant date | May 14, 2013 |
| Priority date | — |
| Expiry date | Feb 24, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06K19/07767
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides methods for manufacturing a radio frequency (RF) powder including a plurality of RF particles, each of which includes a circuit element. A plurality of circuit elements, each corresponding to a different RF particle, may be formed on a first surface of a substrate. Grooves may be etched into the first surface of the substrate between the plurality of circuit elements. A protection film may be formed on each of the plurality of circuit elements and a portion of the substrate between a second, opposite surface of the substrate and bottoms of the grooves may be removed so that each of the plurality of circuit elements is associated with the remaining portion of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.