Method for aligning and bonding elements and a device comprising aligned and bonded elements
US8440504B2 · kind B2 · utility
1Cited by
5References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2008 |
| Grant date | May 14, 2013 |
| Priority date | — |
| Expiry date | Nov 12, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R4/06
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention is related to a method for aligning and bonding a first element (1) and a second element (2), comprising:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.