Positive photosensitive resin composition, cured film, protecting film, insulating film, and semiconductor device and display device using the same
US8440734B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 19, 2009 |
| Grant date | May 14, 2013 |
| Priority date | — |
| Expiry date | Oct 15, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0226
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The object of the present invention is to provide a positive photosensitive resin composition which produces no scum and has high sensitivity and high resolution, a cured film, a protecting film, an insulating film, a semiconductor device using the same. The positive photosensitive resin composition of the present invention comprises a specific polyamide resin (A) and a photosensitive agent (B) comprising an ester of a specific phenolic compound with at least one of 1,2-naphthoquinonediazide-4 sulfonic acid and 1,2-naphthoquinonediazide-5-sulfonic acid. The cured film of the present invention comprises a cured product of the positive photosensitive resin composition. The protecting film and insulating film of the present invention comprise the cured film each. The semiconductor device and display device of the present invention have the cured film each.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.