Molding composition with reduced light scattering
US8440764B2 · kind B2 · utility
3Cited by
12References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 6, 2011 |
| Grant date | May 14, 2013 |
| Priority date | — |
| Expiry date | May 6, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/03
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a molding composition comprising
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.