Curable liquid composition, method of coating, inorganic substrate, and semiconductor device
US8440775B2 · kind B2 · utility
2Cited by
3References
8Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Feb 1, 2008 |
| Grant date | May 14, 2013 |
| Priority date | — |
| Expiry date | Feb 23, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A curable liquid composition obtained by subjecting hydrogen halosiloxane or hydrogen alkoxysilane to condensation or to hydrolysis and condensation in an organic solvent in which fine polyvalent metal oxide particles with hydroxyl groups are dispersed; a method of forming a hard silica-type layer by applying onto an inorganic substrate the aforementioned composition and then curing the composition; an inorganic substrate with the aforementioned hard silica-type layer; and a semiconductor device comprising the aforementioned inorganic substrate on which a semiconductor layer is formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.