Semiconductor device with exposed thermal conductivity part
US8441115B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2011 |
| Grant date | May 14, 2013 |
| Priority date | — |
| Expiry date | Jun 30, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a print circuit part, a lower chip, an upper chip, a thermal conductivity part, and an encapsulation resin. The lower chip and the upper chip are mounted on the print circuit part through wire bonding connection. The thermal conductivity part efficiently dissipates heat from the chips to the outside of the package. The encapsulation resin entirely seals the package while exposing the thermal conductivity part. A adhesive sheet is hardened to form a bonding layer between the thermal conductivity part and the upper chip, a bonding layer between the semiconductor chips, and a bonding layer between the semiconductor chip and the wired component. The configuration contributes to miniaturization, high integration, and heat resistance reduction of a semiconductor package using high-heat-generating ICs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.