Multi-cavity vacuum electron beam device for operating at terahertz frequencies
US8441191B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 24, 2008 |
| Grant date | May 14, 2013 |
| Priority date | — |
| Expiry date | Jul 15, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J25/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention relates to the formation of a vacuum electronics circuit by the fusion bonding of multiple substrate wafers, e.g., silicon, copper, or other suitable conductive material, each etched using DRIE, cut using EDM, or machined by other suitable means. Other aspects of the invention relate to the alignment of a cathode with tube by fusion bonding the cathode wafer to a tube built using the fabrication methods described herein. Yet other aspects involve the alignment of dies or wafers during the fabrication of a vacuum electronics device using the “lego” technique outlined herein. In yet other aspects, fabrication methods are described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.