Patent · US Active

Retaining facility for printed circuit boards on curved surfaces

US8441803B2 · kind B2 · utility

0Cited by

3References

18Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Bernd Beyer · Langensendelbach, DE
Horst Friesner · Meckenheim, DE
Markus Hemmerlein · Neunkirchen, DE
Florian Hofmann · Wiesbaden, DE
Helmut Repp · Erlangen, DE
Wolfgang Schnitzerlein · Kirchehrenbach, DE
Markus Stark · Herrieden, DE
Peter Tichy · Uttenreuth, DE

Key dates

Filing date	Mar 31, 2009
Grant date	May 14, 2013
Priority date	—
Expiry date	Apr 12, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH05K7/1417
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A retaining facility for clearance-free fixing of a printed circuit board onto a one-dimensional curved surface is provided. In the direction of curvature of the one-dimensional curved surface, a tensile or compressive force acts on the printed circuit board or on at least one first connection device connected to the latter, with the printed circuit board being bent and pressed onto the curved surface. In this way the printed circuit board is held solidly and with little vibration on the surface even when acted on by centrifugal forces.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.