Patent · US Active

Cantilever couplers for intra-chip coupling to photonic integrated circuits

US8442368B1 · kind B1 · utility

39Cited by
11References
18Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 22, 2010
Grant dateMay 14, 2013
Priority date—
Expiry dateDec 4, 2030

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG02B6/132
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

Development of Integrated Optical Circuits depends greatly on progress in coupling light to and between chip devices. Exemplary disclosed embodiments provide a system and method of fabricating couplers for optical chips that may allow for access to devices on the entire chip surface. Cantilever couplers comprising optical waveguides are deflected out-of-plane creating access to remote portions of devices. An exemplary system and method may provide waveguides with tunable angles of deflection creating greater flexibility in optical coupling options.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.